Barrier CMP Polishing Slurries
Contact your Entegris account manager or
- Chemical mechanical planarization (CMP)
- Memory device manufacturing
- Logic device manufacturing
Specifications
Slurry type | Integrated circuit (IC) |
Process step | CMP |
Polished material | Tantalum, tantalum nitride, titanium, titanium nitride, cobalt, ruthenium |
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