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Tungsten CMP Polishing Slurries

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Optimal for requirements of next-generation advanced node applications, and offers excellent removal rate, defectivity, and topography for all W applications.

  • Customized formulation optimizes removal rate, limits recess, and meets the most demanding defect requirements
  • Uniquely engineered abrasive particles and chemistry uniformly remove aluminum and the complex stack of work-function metals
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Interested in Tungsten CMP Polishing Slurries?

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