FlowPlane™ Linear Filtration Technology
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- Industry: Semiconductor
- Process: Wet Etch and Clean
- Chemistry: Aggressive Acids, Aggressive Bases and Solvents
- Installation Point: Point-of-Tool
Specifications
Materials: | Membrane | Prewet, nondewetting PTFE |
Supports, shell | PFA | |
Retention rating: | 7 nm | |
Surface area: | 0.60 m² (6.46 ft²) | |
Maximum Operating Conditions: | Maximum operating pressure | 0.59 MPa (5.9 bar; 86 psi) @ 25°C (77°F) |
0.19 MPa (1.9 bar, 28 psi) @ 150ºC (302°F) | ||
Maximum forward differential pressure | 0.39 MPa (3.9 bar; 57 psi) @ 25°C (77°F) | |
Maximum reverse pressure | 0.29 MPa (2.9 bar; 42 psi) @ 25°C (77°F) | |
Maximum operating temperature | 150°C (302°F) | |
Metallic extractables | UCM-10 | Testing conduted for 23 metals |
Other extractables | UCM-10 | TOC, CI, NVR, F |
All FlowPlane product configurations are PFOA free. |
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