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Applications
Reference Materials
CAD
Part Numbers
- Industry: Semiconductor, Data Storage, Flat Panel Display, Bulk Chemical, LED
- Process: Wet Etch and Clean, Bulk Chemical, Substrate Cleaning, Magnetic Head - Wet Etch and Clean, CDA, Organic layer printing, Bulk Gas Delivery
- Chemistry: Solvents, Aqueous Acids, Bases, Detergents, DI Water
- Installation Point: Point of Tool, Bulk, Facilities
Specifications
| Materials: | Membrane: Hydrophobic PTFE |
| Supports, core, sleeve and end caps: Polypropylene | |
| O-rings: EPDM, FKM, E-FKM | |
| Connections: | Code 0 (AS568-222 o-rings) |
| Code 7 (AS568-226 o-rings) | |
| Code F (EP, FKM gaskets) | |
| Retention rating: | 0.05, 0.10, 0.20, 0.50, 1.0, 3.0, 10.0 µm, 10, 20 nm |
| Membrane area: | 10": 7,000 cm² (7.54 ft²) |
| 20": 14,000 cm² (15.1 ft²) | |
| 30": 21,000 cm² (22.6 ft²) | |
| Maximum operating conditions: | Maximum forward/reverse differential pressure: 0.34 MPa (3.4 bar, 50 psi) @ 25°C (77°F) |
| Maximum operating temperature: 90°C (194°F) |
FP-HP Specifications:
| Materials: | Membrane: Hydrophilic PTFE |
| For 0.02 µm - prewet, nondewetting PTFE* | |
| Supports, core, sleeve and end caps: Polypropylene | |
| O-rings: EPDM, FKM, E-FKM | |
| Connections: | Code 0 (AS568-222 o-rings) |
| Retention rating: | 0.05, 0.10, 0.20, 0.50, 1.0, 3.0, 10.0 µm, 10, 20 nm |
| Membrane area: | 10": 7,000 cm² (7.54 ft²) |
| 20": 14,000 cm² (15.1 ft²) | |
| 30": 21,000 cm² (22.6 ft²) | |
| Maximum operating conditions: | Maximum forward/reverse differential pressure: 0.34 MPa (3.4 bar, 50 psi) @ 25°C (77°F) |
| Maximum operating temperature: 90°C (194°F) | |
| * The prewet filter is enclosed in a bag containing DI water and 1% H₂O₂. After installation is completed, drain and flush with 20 liters of DI water (per 10''). | |
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