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Reference Materials
CAD
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Applications
- Industry: Semiconductor (Wet Etch and Clean, Bulk Chemical Delivery)
- Chemistry: Dilute Acids
- Installation Point: Point-of-Tool
Specifications
| HP | HPX | HPM | HSM | |||
|---|---|---|---|---|---|---|
| Materials: | Membrane: | Hydrophilic ultra-high molecular weight polyethylene (UPE) | Hydrophilic polysulfone (PS) | |||
| Supports, sleeve, end caps, core | Nonwoven high-density polyethylene (HDPE) | |||||
| Code 0 double 2-222 o-rings | Encapsulated fluoropolymer (E-FKM) or Kalrez® 4079 and 6375 | |||||
| Chem-Line™ II disposables’ outer shell | NA | Polypropylene | Polypropylene | Polypropylene | ||
| Chem-Line™ I disposables’ outer shell | NA | NA | PFA | PFA | ||
| Retention rating: | 0.2, 0.1, 0.05 µm | 0.2, 0.1, 0.05 µm | 0.05, 0.03 µm, 10 nm | 20, 7 nm | ||
| Membrane surface area: | 10": 0.85 m² | 4": 0.5 m² 10": 1.1 m² 20": 2.2 m² |
10": 1.9 m² 20": 3.8 m² 30": 5.7 m² |
4": 0.6 m² 10": 1.2 m² 20": 2.4 m² |
||
| Maximum operating conditions: | Maximum forward differential pressure | 0.34 MPa (3.4 bar; 50 psid) @ 25°C (77°F) | ||||
| Maximum reverse pressure | 0.21 MPa (2.1 bar; 30 psi) @ 25°C (77°F) | |||||
| Maximum operating temperature | 70°C (158°F) @ 30 psi | 70°C (158°F) @ 23 psi | ||||
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