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Applications
Reference Materials
CAD
Part Numbers
- Industry: Semiconductor, Flat Panel Display, Data Storage, LED
- Process: Wet Etch and Clean, Substrate - Ni-P Plating, Magnetic Head - Wet Etch and Clean, Bulk Chemical Delivery, Chemical
- Chemistry: Aggressive Acids, Aggressive Bases
- Installation Point: Point of Tool
Specifications
| Materials: | Membrane | PTFE |
| Support | PFA | |
| O-ring | Encapsulated FKM (E-FKM) | |
| Retention rating: | 0.05, 0.1, 0.2, 0.5, 1, 5, 10 µm | |
| Shelf life (prewet option): | 1 year | |
| Membrane area: | 4" | 0.23 m2 (2.48 ft2) |
| 10" | 0.8 m2 (8.61 ft2) | |
| 20" | 1.6 m2 (17.22 ft2) | |
| 30" | 2.4 m2 (25.83 ft2) | |
| Maximum operating conditions: | Maximum forward differential pressure | 0.51 MPa (5.1 bar, 74 psi) @ 25°C (77°F) |
| Maximum reverse differential pressure | 0.35 MPa (3.5 bar, 50 psi) @ 25°C (77°F) | |
| Maximum operating temperature | 120°C (248°F) at the above conditions | |
| Notes: | Prewet filters are enclosed in bag filled with DI water and 1% H202. Drain and flush with 20 liters of DI water (per 10”) after installing filter. Savana® AT can be sterilized by autoclaving up to 50 cycles at 125°C or sterilized by steam-in-place up to 50 cycles at 135°C for 30 minutes at less than 0.3 bar differential pressure. | |
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