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A300 Thin Wafer FOUPs

Are specifically designed for supporting thin wafers while providing superior microenvironment control that provides clean and secure 300 mm wafer transport.

  • The 13-capacity design provides additional support for thin wafers while providing extra room for automation to transfer wafers.
  • Larger wafer supports reduce the amount of wafer sag
  • Optimized materials such as Entegris moisture barrier material (EBM) provide wafer contact and microenvironment control, enabling leading-edge wafer processing technology
  • Purge options are available including front/rear purge that provides maximum gas dispersion
  • An optional ESD shell provides added wafer protection in environments prone to electrostatic charge accumulation
  • Industry-proven door provides equipment interoperability and long life
  • Integral wafer supports allow excellent wafer plane performance and reliable wafer access
  • Read More Read Less
Interested in A300 Thin Wafer FOUPs?

Contact your Entegris account manager or

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