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Spectra™ FOUPs

Front-opening, unified pod platform with superior microenvironment control. The Spectra™ FOUP provides clean and secure wafer transport, optimum automation in integration and low cost of ownership for your facility.

ESD shell option for added wafer protection
Advanced purge options
Optimized for wafer contact and microenvironment control

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Specifications

Product Specifications

Dimensions:	Width	416 mm (16.4")
	Depth	333 mm (13.1")
	Height	335 mm (13.2")
Weight:	Empty	4.2 kg (9.26 lb)
	With Wafers	7.3 kg (16.09 lb)
Wafer spacing:	10 mm (0.39")
Capacity:	25 wafers

Successfully Opted for software Updates

Reference Materials Product Documentation

Published Oct 1, 2012 Data Sheet Spectra™ FOUP

Download PDF 110.6 kB

Published Nov 29, 2018 Brochure Total Wafer Carrier Solutions

Download PDF 1.1 MB

Part Numbers

Spectra™ FOUPs Part Numbers

Part Number	Color
SEFEEN-ANSRK-NNN	Black
SPFAAN-ANSRK-NNN	Amber
SPFCCN-ANSRK-NNN	Clear
SPFGGN-ANSRK-NNN	Green
SPFRRN-ANSRK-NNN	Red