Spectra™ FOUPs

Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport.

Industry-proven door provides equipment interoperability and long life
Integral wafer supports give excellent wafer plane performance and reliable wafer access
ESD shell option provides added wafer protection
Advanced purge options are available including front/rear purge and a purge diffuser that provides maximum gas dispersion
Optimized hydrophobic materials provide wafer contact and microenvironment control

Interested in Spectra™ FOUPs?

Contact your Entegris account manager or

Top of page

Applications Spectra™ FOUPs Applications

Product Specifications

Dimensions	Width	416 mm (16.4")
	Depth	333 mm (13.1")
	Height	335 mm (13.2")
Weight	Empty	4.2 kg (9.26 lb)
	With wafers	7.3 kg (16.09 lb)
Wafer spacing	10 mm (0.39")
Capacity	26 wafers
Materials of Construction Ultrapure polycarbonate or barrier material used in the FOUP shell, door housing, and door panels Carbon-filled PEEK or high-temperature barrier material (XT EBM) used in wafer contact areas in the shell, door housing, and door components Thermoplastic elastomer material used in the critical door seal Entegris moisture barrier material (EBM) available to enable leading-edge wafer processing technology Configuration Options and Accessories Shell and Door Color Options Amber, red, green, clear, and black (ESD shell only) Purge Options Front/rear standard purge Rear advanced diffuser Segregation Options Info pads configurable by customer Identification Options Bar code and alphanumeric character labels Color handle inserts Cardholders RFID tags with read/write capability

Successfully Opted for software Updates

Reference Materials Product Documentation

Published Jun 7, 2021 Data Sheet Spectra™ FOUPs

236.8 kB

Published Jun 7, 2021 Data Sheet Spectra™ FOUPs - A4

236.8 kB

Published Jul 1, 2021 Brochure Total Wafer Carrier Solutions

2.9 MB