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Spectra™ FOUPs

Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport. 

  • Industry-proven door provides equipment interoperability and long life
  • Integral wafer supports give excellent wafer plane performance and reliable wafer access
  • ESD shell option provides added wafer protection
  • Advanced purge options are available including front/rear purge and a purge diffuser that provides maximum gas dispersion
  • Optimized hydrophobic materials provide wafer contact and microenvironment control
  • Read More Read Less
Interested in Spectra™ FOUPs?

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