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A300 FOUPs

Front opening unified pod (FOUP) platform with superior microenvironment control that provides clean and secure 300 mm wafer transport. 

  • 25- or 13-capacity FOUPs are available for thin, standard, and thick wafer substrates
  • Optimized materials such as Entegris moisture barrier material (EBM) provide wafer contact and microenvironment control, enabling leading-edge wafer processing technology
  • An optional ESD shell provides added wafer protection in environments prone to electrostatic charge accumulation
  • Industry-proven door provides equipment interoperability and long life
  • Integral wafer supports allow excellent wafer plane performance and reliable wafer access
  • Advanced purge options are available including front/rear purge and a purge diffuser that provides maximum gas dispersion
  • Read More Read Less
Interested in A300 FOUPs?

Contact your Entegris account manager or  contact us

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