A300 Heavy Duty Payload FOUPs
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Applications
- FOUP platform that provides clean and secure 300 mm transport and handling of thick, bonded, 3D-IC, and warped 300 mm wafers
- Automation compatibility provides a low cost of ownership
Specifications
| 13 Capacity | 25 Capacity | ||
| Materials of construction | Shell, door housing, door panels | Ultrapure polycarbonate (PC) | Ultrapure polycarbonate (PC) |
| Wafer supports and contact areas (shell, door housing, door components) |
Carbon-filled PEI material | Carbon-filled PEI material | |
| Door seal | Thermoplastic elastomer | Thermoplastic elastomer | |
| Dimensions | Width | 426 mm (16.8") | 426 mm (16.8") |
| Depth | 355 mm (14.0") | 355 mm (14.0") | |
| Height | 338 mm (13.3") | 338 mm (13.3") | |
| Maximum Load | (FOUP + Wafers) | 15 kg | 15 kg |
| Weight | Empty | 5.3 kg (11.7 lb) | 5.4 kg (11.9 lb) |
| With wafers | Depends on wafer thickness | Depends on wafer thickness | |
| Wafer spacing | 20 mm (0.78") | 10 mm (0.39") | |
Configuration Options |
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| Shell and door colors options | PC clear | ||
| Purge options | Front/rear standard purge | ||
| Segregation options | Configurable info pads | ||
| Identification options | Colored handles - amber, black, blue, green, red, white, yellow Colored cardholders - amber, green, white Bar code and alphanumeric character labels RFID tags with read/write capability |
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