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Medea™ CMP Pads

Using thermoset polyurethane technology, our Medea™ CMP pads provide additional grooving technology and customization, which is ideal for use in 200 mm and 300 mm wafer applications.

  • Additional grooving technology allows customizable groove patterns to meet your unique process needs
  • Wide range of hardness and porosity options enable customizations for all nodes and applications in integrated circuit (IC) chemical mechanical planarization (CMP) manufacturing to improve desired key performance parameters and pad life
  • Chemically inert materials of construction provide broad compatibility with a full range of slurry products
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Interested in Medea™ CMP Pads?

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