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NexPlanar™ CMP Pads

Using thermoset polyurethane technology, our NexPlanar™ CMP pads enable customers to manufacture smaller, faster, and more complex devices.

  • Wide range of hardness and porosity options enable customizations for all nodes and applications in integrated circuit (IC) chemical mechanical planarization (CMP) manufacturing to improve desired key performance parameters and pad life
  • Chemically inert materials of construction provide broad compatibility with a full range of slurry products
  • Element CMP pad series serve as the foundation of NexPlanar technology and are used in a variety of CMP applications
  • Ultra CMP pad series uses advanced NexPlanar polyurethane technology and targets advanced nodes requiring superior performance
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Interested in NexPlanar™ CMP Pads?

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