Join us for the following presentations:
Entegris CTO, Dr. Jim O’Neill will present: Materials Challenges on the Path to 1nm
WEDNESDAY, SEPTEMBER 29 | 1:50 – 2:20 PM
To keep on the path to 1nm, Jim will discuss lateral scaling with EUV, scaling with vertical integration and the materials challenges associated with each approach.
Wednesday, September 29 | 5:25 - 5:30 PM
Entegris Vice President of Marketing, Dr. Wenge Yang will offer closing remarks for the conference
Holistic Approach to Enabling Device Performance, Yield, and Reliability
Logic devices are getting smaller, and the introduction of 3D architectures that use vertical fins and nanowires in their gate design introduce more complexity to the fabrication process. As technology nodes shrink beyond 10 nm, new materials are required in both FEOL and BEOL processes to enable performance, yield, reliability and cost.