Featured Presentation

Characterization and Removal of Metallic Contamination in Process Chemicals Using Single Particle Inductively Coupled Plasma Mass Spectrometry (SP-ICP-MS)

Tuesday, April 13 | 12:20 – 12:40 CEST

Session III: Contamination and Contamination Control

By Sampath, Siddarth; Maharjan, Kusum; Ozzello, Anthony; Bhabhe, Ashutosh


Featured Content

Pervasive Defectivity in Semiconductor Manufacturing

Most equipment and process engineers become experts at analyzing a wafer map to quickly identify signatures. They can easily identify when their equipment or process was the perpetrator of a maverick yield event. But as defect signatures become more subtle and harder to quickly identify, there is a significant need to consider not just what the in-line inspection systems are identifying, but specifically what they are not identifying.

Clean Chemical Delivery

To achieve optimal wafer yield and reliability, the microelectronics industry needs to address the increased materials consumption requirements and material purity challenges from chemical manufacture to point of use.