Chemical Mechanical Planarization (CMP)
Integrated CMP solutions for optimal performance and lower cost of ownership in advanced packaging applications.
Our CMP and post-CMP solutions are engineered to deliver a high polish rate with uniform removal while minimizing micro scratch and underlayer defects. By optimizing slurry chemistry, pad performance, and cleaning formulations, we enable superior surface planarity, reduced particle contamination, and stable downstream processing. This results in cleaner wafers, higher yields, and lower cost of ownership.
Defect Prevention Solutions
CMP Contamination Control
Prevent Cu dishing, scratch, and void defects with Entegris’ integrated CMP solutions approach.
Post-CMP Contamination Control
Ensure efficient and effective residue and embedded particle removal with integrated cleaning solutions, brushes, and filtration solutions.
Process Monitoring Solutions
Control removal rate variances with liquid particle counters, particle size analyzers, and real-time concentration monitors.
From Lab to Fab: The Art and Science of Capturing the Uncatchable in CMP Filtration
This study demonstrates that filtration performance is influenced by multiple factors, including slurry chemistry, flow dynamics, and filter design. Nanofiber filters mitigate shear-induced agglomeration and significantly reduce LPC, while APR filters extend this capability by capturing both LPC and FPC without altering particle size distribution.