Facility
Clean materials delivery and ultraclean fab environment solutions to reduce fab defects and improve yield.
Purity in the fab environment is paramount to meeting wafer yield and device performance standards. A holistic clean material delivery strategy can control the integrity of liquids, gases, ambient environment, wafer surfaces, and masks and prevent electrostatic discharge (ESD). This approach ensures operator safety and protects key contamination points throughout the supply chain from material and wafer generation to delivery, storage, and dispense.
Defect Prevention and Process Operational Solutions
Gas Contamination Control Solutions
Prevent wafer defects through the electronic gas supply chain with integrated contamination control and delivery solutions.
Liquid Contamination Control Solutions
Prevent wafer defects through the electronic chemicals supply chain with integrated contamination control, process monitoring, and delivery solutions
Process Optimization Solutions
Precisely control and monitor process fluids in harsh environments and ultrapure applications.
ESD Fluid Management
Prevent wafer level ESD defects, protect devices, and ensure operator/facility safety with continuously conductive polymers.
ESD Grounding Straps
Dissipate electrostatic charge to protect wafers/panels and devices and ensure operator/facility safety.
ESD Foups
Prevent ESD particle generation and accumulation in wafer and handling applications.
Clean Gas Delivery
Learn how advanced contamination control strategies can reduce incoming gas inspection failures and maintain the purity baseline.