Post-CMP Cleaning Solutions
Industry-leading solutions for advanced post-CMP cleaning in semiconductor and HDD applications.
Post-chemical mechanical planarization (pCMP) cleaning is required to remove particles, residues, and contaminants from substrates without generating scratches, surface roughness, or corrosion.
We offer application-specific solutions for pCMP cleaning that provide excellent corrosion control, surface contamination removal, and cost of operational performance.
Our extensive portfolio includes industry-leading cleaning chemistries for the semiconductor industry, wide band gap semiconductor (WBGS) industry (substrates such as SiC, GaN, etc.) and for the hard disk drive (HDD) industry including nickel-phosphorus plated substrate and media, and glass substrate and media.
In a hard disk drive (HDD), the magnetic heads fly at 3 nm or less above a disk. The disks must be critically lapped, polished, planarized, and cleaned to remove asperities and contaminants that would cause a catastrophic head-disk crash. We develop and manufacture a range of cleaners used in all stages of magnetic head fabrication.