Tailored pads and pad conditioners that enable CMP technologies.
Chemical mechanical planarization (CMP) is used to polish wafer surfaces between layers of material deposition. As semiconductor nodes shrink and chip architectures become increasingly more complex, CMP continues to evolve and gain in critical importance.
We use a holistic approach in our development of CMP pads and pad conditioners to deliver industry-leading innovation that enhances yield and process stability. Our portfolio of Planargem® XT pad conditioners delivers long life and highly uniform pad conditioning while our portfolio of CMP pads provides exact hardness, pore sizes, and compressibility to meet CMP application requirements.