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CMP Pads and Pad Conditioners

Tailored pads and pad conditioners that enable CMP technologies.

Chemical mechanical planarization (CMP) is used to polish wafer surfaces between layers of material deposition. As semiconductor nodes shrink and chip architectures become increasingly more complex, CMP continues to evolve and gain in critical importance. 

We use a holistic approach in our development of CMP pads and pad conditioners to deliver industry-leading innovation that enhances yield and process stability. Our portfolio of Planargem® XT pad conditioners delivers long life and highly uniform pad conditioning while our portfolio of CMP pads provides exact hardness, pore sizes, and compressibility to meet CMP application requirements.

Featured Pictogram

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Customizing CMP for Silicon Carbide Wafers
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Customizing CMP for Silicon Carbide Wafers
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Featured Pictogram

download-pdf
Customizing CMP for Silicon Carbide Wafers
Download Now
Narrow Your Selection
  • Brand Name
  • Industry
  • Process
NexPlanar™ CMP Pads
NexPlanar™ CMP Pads
NexPlanar™ CMP Pads
Using thermoset polyurethane technologies, our NexPlanar pads enable customers to manufacture smaller, faster, and more complex devices
Brand Name
  • NexPlanar™
 Product Type
  • CMP pad
 Industry
  • Semiconductor
 Process
  • CMP
Medea™ CMP Pads
Medea™ CMP Pads
Medea™ CMP Pads
Provides additional grooving capability and customization of thermoset polyurethane technology, which is ideal for use in 200 mm and 300 mm wafer applications
Brand Name
  • Medea™
 Product Type
  • CMP pad
 Industry
  • Semiconductor
 Process
  • CMP
Epic™ CMP Pads
Epic™ CMP Pads
Epic™ CMP Pads
Proven, reliable thermoplastic polishing pads for 150 mm, 200 mm, and 300 mm applications
Brand Name
  • Epic™
 Product Type
  • CMP pad
 Industry
  • Semiconductor
 Process
  • CMP
Epic Power™ CMP Pads
Epic Power™ CMP Pads
Epic Power™ CMP Pads
Thermoplastic polishing pads for silicon carbide (SiC) wafers that offer the optimal balance of best-in-class performance, quality, and cost of ownership
Brand Name
  • Epic Power™
 Product Type
  • CMP pad
 Industry
  • Semiconductor
 Process
  • CMP
Planargem® XT CMP Pad Conditioners
Planargem® XT CMP Pad Conditioners
Planargem® XT CMP Pad Conditioners
Micro-machined SiC substrate delivers long life, highly uniform pad conditioning while minimizing substrate damage
Brand Name
  • Planargem®
 Product Type
  • Pad conditioner
 Industry
  • Semiconductor
  • Data Storage
 Process
  • CMP
  • Glass disk polishing
Planargem® CMP Pad Conditioner
Planargem® CMP Pad Conditioner
Planargem® CMP Pad Conditioner
Micro-machined SiC substrate with conformal CVD diamond coating delivers long-life, highly uniform pad conditioning while minimizing substrate damage
Brand Name
  • Planargem®
 Product Type
  • Pad conditioner
 Industry
  • Semiconductor
 Process
  • CMP
Related Product Categories
200 mm Wafer Processing

With over 50 years of experience in advanced wafer handling and transport, Entegris continues to provide safe and reliable 200 mm wafer processing solutions.
150 mm Wafer Processing

To support the semiconductor industry's requirements for advanced 150 mm wafer handling, we offer a variety of wafer carriers, handling solutions and accessories that safely transport your silicon wafers.
125 mm Wafer Processing

Reliable wafer carriers and storage boxes that address the automation, contamination, and productivity concerns of today's 125 mm (5") fabs.

150 mm and Smaller Wafer Carrier Accessories

Learn about the numerous wafer carrier handles, wafer retainers, storage box cushions, and traveler envelopes available for use with our 150 mm (6"), 125 mm (5"), and 100 mm (4") wafer storage and handling products.
100 mm Wafer Processing

With over 50 years of experience in advanced wafer handling and transport, Entegris continues to provide 100 mm (4") wafer processing solutions to safely and reliably transport and protect silicon wafers.

300 mm Front Opening Unified Pods (FOUPs)

Our FOUPs (front-opening unified pods) hold 300 mm wafers safely and securely while they are transported and transferred within the fab as they move through hundreds of sophisticated process steps. Designed to address not only particles but to also minimize and control VOC, oxygen, and relative humidity (RH), our FOUPs provide superior microenvironment control, optimum automation integration, and low cost of ownership.
200 mm Accessories

Optimize the cleanliness and performance of your A200 and M200 wafer microenvironments with E200 door assemblies, replacement gaskets, handles, door seal kits, and more. 
Labware

We offer a wide variety of labware products to assist with wafer processing. Learn about our tweezers, tongs, vacuum probes, beakers, funnels strainers, dippers, baskets, trays, and more.
76.2 mm 3" Wafer Processing

With over 50 years of experience in advanced wafer handling and transport, Entegris continues to provide 76.2 mm (3") wafer processing solutions to safely and reliably transport and protect silicon wafers.

Chucks

Our chuck solutions use innovative coating technologies which make for a very flat surface that prevents metal contamination, reduces particles and is durable to last millions of wafer cycles.
2.5" and Smaller Wafer Processing

With over 50 years of experience in advanced wafer handling and transport, Entegris continues to provide 2.5" and smaller wafer processing solutions to safely and reliably transport and protect silicon wafers.

CMP Cleaning Brushes

Our portfolio of Planarcore® PVA brushes delivers superior performance and wafer-to-wafer uniformity in post-CMP wafer cleaning applications.

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