Horizontal Carriers
Contact your Entegris account manager or
- Custom wafer carriers for high-temperature environments
- Chamber components for thermal and plasma processes
- Available in contiguous or non-contiguous styles in 100 mm, 125 mm, 150 mm and 200 mm sizes
- Entegris standard styles are one-third round and monolithic carriers
- SEMI® Standard or custom slotting available
Specifications
Typical Material Properties
PROPERTY | SUPERSiC | SUPERSiC |
Apparent density: | 3.13 g/cm3 | 3.15 g/cm3 |
Bulk density: | 2.53 g/cm3 | 2.55 g/cm3 |
Total porosity: % of volume | 20% | 20%1 |
Open porosity: | 19% | 0%2 |
Total impurity level: | <10 ppm | <10 ppm |
Flexural strength: | 155 MPa | 155 MPa |
Tensile strength: | 129 MPa | 129 MPa |
Elastic modulus: | 217 GPa | 217 GPa |
Specific stiffness: | 86 kN.m/g | 85 kN.m/g |
Poisson’s ratio: | 0.17 | 0.17 |
Dynamic shear modulus: | 97 GPa | 97 GPa |
Fracture toughness: | 2.4 MPa.m0.5 | 2.4 MPa.m0.5 |
Hardness knoop: | 1992 kg/mm2 | N/A |
Thermal diffusivity: | 100 mm2/s | 100 mm2/s |
Thermal conductivity: W/m.K (Btu/hr/ft°F) | 170 | 170 |
Instantaneous coefficient of thermal expansion at RT: | 2.4 10-6/K | 2.4 10-6/K |
1Porosity is sealed under the dense coating; porosity is not exposed to the process. 2Porosity sealed off by CVD SiC coating.
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