Planargem® CMP Pad Conditioner
Interested in Planargem® CMP Pad Conditioner?
Contact your Entegris account manager or
Top of page
Applications
- Semiconductor
- CMP
Specifications
| Materials | ”Cutting” surface | Proprietary CVD diamond coating |
| Carrier | Silicon carbide | |
| Feature size | 85 µm, 125 µm, 160 µm, 200 µm, 300 µm | |
| Spoke or channel configuration | ||
| Feature density | 0.25 per mm2 to 15 per mm2 | |
| Feature depth | 15 µm, 20 µm, 35 µm, 70 µm, flexible | |
| Segment size | Standard, flexible | |
| Segments per disc | 1, 4, 5, 6, 8 flexible | |
| Holder types | Stainless, plastic, magnetic, snap-on, flat, flexible | |
Successfully Opted for software Updates