Planargem® XT CMP Pad Conditioners
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Reference Materials
Applications
- Semiconductor dielectric and metal CMP
- Glass disk polishing (for hard disk drive)
Specifications
Disk Selector as a Function of Application
| Application | Conditioner aggressiveness | 4.25" standard backing | 4" magnetic backing | 4.32" thin backing |
| High output | High | PRX85SC | PMX85SC | – |
| Low | PRX35SB | PMX35SB | – | |
| General utility | High | PRX45SB | PMX45SB | – |
| Medium | PRX35SE | PMX35SE | – | |
| Low | PRX45SE | PMX45SE | – | |
| Gentle | High | PRX35SD | PMX35SD | – |
| Medium | PRX35SG | PMX35SG | – | |
| Low | PRX45SA | PMX45SA | – | |
| HDD glass disk polish | – | – | PPX25SA | |
Test Reports
Reference the test reports attached below to see the effect pad cut rate (PCR) and pad surface roughness (Sa) have on wafer removal rates (RR).
| Materials | ”Cutting” surface | Proprietary CVD diamond coating |
| Carrier | High-density silicon carbide | |
| Feature size | 10 µm to 100 µm flexible | |
| Feature depth | 15 µm, 20 µm, 35 µm, 50 µm, flexible | |
| Segments per disc | 5, 6, 8 flexible | |
| Holder types | Stainless, magnetic | |
Successfully Opted for software Updates
Published May 13, 2021
Technical Note
Pad Cut Rate and Surface Roughness as a Function of Disk Design
144.9 kB