Join Us | BOOTH 11
This year at ICPT, Entegris will focus on the need for complete solutions that improve yield in all aspects of the CMP process. Shrinking feature size, along with the need for tighter defectivity and particle control in the CMP slurry is driving innovative changes in filtration and monitoring systems. As more layers of each chip require CMP to achieve planarity, the process challenges are increasing dramatically. We are in the position to offer single source solutions and eliminate introducing unnecessary contamination risk from incompatible chemicals or consumables. As today’s leading-edge chip designs become tomorrow’s mainstream products, single sourcing offers tremendous benefit to all fabs.
Featured Presentations
Tutorials - October 15th, 11:30 a.m.
The CMP Consumables Ecosystem
Mario Stella, Fab Technology Engineering Director, Entegris
Poster sessions - October 16, 4:50 p.m.
Optimizing Wafer Polishing: Innovations in CMP Techniques and Filtration
Chloe Chen, Applications Development Engineer, Entegris
Discover our latest research on nano-meltblown filters and how they were able to stabilize large particle count levels, a critical step for reducing defectivity during the polishing process.
Advanced Filtration Solution for LPC Removal Efficiency Enhancement in CMP Applications
Alan Chao, R&D Engineer, Entegris
Learn how Entegris addressed polishing slurry filtration challenges by using a new polypropylene membrane solution.