Chemical Mechanical Planarization (CMP)

Major fabs understand the need for complete solutions that improve yield in all aspects of the CMP process. Shrinking feature size, along with the need for tighter defectivity and particle control in the CMP slurry is driving innovative changes in filtration and monitoring systems. As more layers of each chip require CMP to achieve planarity, the process challenges are increasing dramatically.

We are in the position to offer single source solutions and eliminate introducing unnecessary contamination risk from incompatible chemicals or consumables. As today’s leading-edge chip designs become tomorrow’s mainstream products, single sourcing offers tremendous benefit to all fabs.