Join Us | Silicon Saxony Hall B1 | Booth #B1221-01
As AI, high-performance computing, automotive electrification, and advanced connectivity accelerate demand for next-generation semiconductor technologies, Europe is strengthening investments across the value chain to drive innovation, resilience, and competitiveness. SEMICON Europa provides a platform for insights, partnerships, and discussions that will help shape the industry's next chapter.
As part of this year's program, Entegris is pleased to contribute to a timely discussion on one of the industry's most important strategic priorities: advanced packaging. Stop by to discuss current industry challenges, learn about the latest developments in semiconductor manufacturing and advanced packaging, and explore opportunities to connect and collaborate.
Need a complimentary ticket? Contact europe@entegris.com to get a free event pass.
Entegris Executive Forum Session
ADVANCED PACKAGING: FROM STRATEGIC IMPERATIVE TO SCALABLE REALITY IN EUROPE
Wednesday, November 11 | 2:00 PM – 3:40 PM
Executive Forum | Hall C1
Advanced packaging has become a key driver of semiconductor performance, integration, and competitiveness as traditional scaling reaches its limits. Technologies such as heterogeneous integration, chiplets, fan-out, and panel-level packaging are enabling new system-level gains across AI, high-performance computing, industrial, and automotive applications.
Join Entegris and Porsche Consulting for a panel discussion bringing together industry leaders to discuss how Europe can translate advanced packaging innovation into scalable industrial deployment and strengthen its long-term semiconductor competitiveness.
Stay tuned for the full lineup! Visit the official SEMI event page for the latest updates and full session details as they become available.
Moderator:
Wenge Yang
VP Marketing, Entegris
Speakers:
Gilbert Parry
Director, Advanced Innovation & Technology, Entegris
Marco Paul
Senior Expert - Automotive External, Porsche Consulting
Jonas Altmann
Senior Manager - Development & Technology, Porsche
Event Related Content
Interface integrity defines yield in advanced packaging, governing how surfaces, materials, and processes interact to determine performance and reliability. As architectures move toward hybrid bonding, high density RDL, and panel level integration, interfaces are created once and carried through multiple stresses with no opportunity for repair.
With today’s faster, diverse, and more thermally efficient device designs, success depends not just on perfecting individual components, but on ensuring the entire advanced package performs flawlessly to design specifications for everyday use. Entegris delivers proven technologies that safeguard materials purity, materials performance, substrate integrity and yield at the most critical stage of your investment. See our solutions to the most common and complex advanced packaging challenges.