Heterogeneous integration drives new demands to solve wafer and substrate handling and shipping challenges. From thick and heavy payload to thin, warped, or contact-sensitive substrates, Entegris advanced packaging family of FOUPs, film frame shippers, and contactless horizontal shippers ensure safe, stable, and contamination-free handling with electrostatic discharge (ESD) protection.
Defect Prevention Solutions
Ensure safe transport of substrates of all materials, sizes, shapes, thickness, and planarity with FOUPs, film frame shippers, and carriers.
Solving Substrate Handling Challenges
Discover how Entegris collaborates with partners to overcome advanced packaging substrate challenges, improving semiconductor performance, yield, and scalability through innovative materials and process solutions.
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