Cars and Chips: The New Collaborative Approach
As the automotive paradigm shifts from mechanical to electronic-centric vehicles, carmakers must now meet parts per billion (ppb) failure rates.
To achieve these goals and improve long-term reliability, they look to semiconductor manufacturers and the automotive component supply chain
to collaborate in meeting these goals and assure the functional safety of new modes of transportation.
Featured White Paper
New Continuous Improvement Opportunities for Semiconductor Technologies Entering the Automotive Domain
This paper, New Continuous Improvement Opportunities for Semiconductor Technologies Entering the Automotive Domain, illustrates anonymized case studies and fab benchmarks to bridge the gap between design and process engineering in order to infer best practices for automotive related semiconductor manufacturing.
Live Webinar
Panel Discussion: New Updates in Optimizing Automotive Electronics Reliability
September 14 | 11:00 AM EST, 8:00 AM PST
Join Wenge Yang, VP, Market Strategy – Entegris, along with panelists from Texas Instruments, Robert Bosch, and Volkswagen Group to explore how distributed architectures, AI, wideband gap materials, chiplets and higher frequency devices are driving a new era of innovation and collaboration between car makers and chip makers.
Hosted by: Pete Singer, Editor, Semiconductor Engineering
Webinar
NCA: How to Support the Automotive Industry to Reach Zero Defects
Join Antoine Amade, EMEA/NA senior director – Entegris Automotive Program, in this recorded webinar as he explores the ‘New Collaborative Approach’, a new model of engagement targeting contamination control to improve automotive defectivity and reliability.
Featured Article
A Collaborative Approach for Automotive Electronics
Read about the automotive electronics manufacturing collaboration model with CARIAD SE, a Volkswagen Group Company and Entegris to address the functional safety needs from a systems perspective.
Feature Video
New Collaborative Approach
Antoine Amade, Entegris Senior Director, EMEA/NA Sales, explains the important role semiconductor material purity and performance have on reducing latent defects in the automotive industry, and how a collaborative approach and strong contamination management strategy can help ensure electronic reliability and driver safety. Runtime: 03:26.
Featured White Paper
Cars and Chips: The Acceleration of Electronic Systems
This white paper presents an automotive supply chain collaboration model to examine the influence chemical, gas, and air contamination have on the long-term reliability of integrated circuits used in all forms of driver-assist and autonomous transportation hardware.
Advanced CMP of Silicon Carbide for EVs and Power ICs
This paper describes challenges specific to CMP of SiC wafers and proposes solutions to improve SiC slurry performance and meet the needs of power IC manufacturers.
Featured White Paper
Small, Medium, and Large of Preventing Automotive Latent Defects
This white paper details the challenges facing automotive OEMs, semiconductor fabs, and tier one suppliers, and identifies solutions for improving the cleanliness of the chemicals, gases, and air used to create microchips.
Blogs
Connecting Automotive and Semiconductor Supply Chains to Drive Functional Safety Excellence
In this panel discussion, CARIAD SE, a Volkswagen Group company, Entegris, and SEMI shared their perspectives on how the automaker and other members of the automotive electronics ecosystem can collaborate to address new challenges facing the automotive industry.
The Acceleration of Electronic Systems
The automotive manufacturing paradigm shift leads the supply chain to develop electronic systems that meet parts per billion (ppb) failure rates. This requires changing from an electronic component mindset to a system engineering mindset, focused on the validation and verification.
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Q. What is the difference between a killer and a latent defect?
- A killer defect is chip failure detected in the fab. A latent defect is failure detected in the field (i.e., once installed in the electronic device). Latent defects cannot be discovered in the fab or assembly process, despite rigorous wafer and functional device testing protocols.
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Q: What is the expected lifetime of an integrated circuit used in automotive applications?
- Each device has a unique expected lifetime. Much like aerospace, medical, military, and select IoT applications, automotive applications have higher reliability requirements to ensure greater longevity.
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Q: What is the mission of the SEMI GAAC (Global Automotive Advisory Council)?
- The GAAC’s mission is to connect the automotive supply chain in a collaborative forum focused on solving the challenges presented by automated transportation technologies. Members include carmakers, material and tool suppliers, hardware and software makers, designers, and other industry leaders.
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Q: What is the New Collaborative Approach (NCA)?
- NCA is a collaboration model that brings all members of a supply chain together to solve challenges that each member could not solve on their own. It can be applied in all industries and applications, such as automotive, IoT, high-performance computing and data centers, medical, mobile, military, and aerospace.
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Q: What are the three elements of a contaminant management strategy?
- Semiconductor fabs rely upon the purity of the chemicals, process gases, ambient air, and wafers to ensure the wafer yield, device performance, and component reliability meet automotive quality requirements. A holistic approach to contamination management creates the assurance of purity throughout the supply chain.
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Q: What are the types of contaminants that a fab should be most concerned with controlling?
- There is no “one size fits all” approach. Contaminants include particles, metals, ions, organics, non-volatile residues and AMC (airborne molecular contaminants). Each contaminant type presents specialized scenarios and requires a unique detection and removal strategy.
Related Topics
Achieving your zero-defect goals require contaminant-free chemicals and DI water. Preventing these defects requires a holistic approach from the raw materials to the chemical maker, through the delivery, storage, and dispense steps in the semiconductor fab.
Achieving your zero-defect goals require contaminant-free process gases. Preventing these defects requires a holistic approach from the gas generation source through the delivery, storage, and dispense steps in the semiconductor fab.
Through the front (FEOL) and back end (BEOL) of semiconductor manufacturing lines, wafers are continuously transported and stored. Entegris solutions prevent the corrosion that may lead to reliability failures and wafer breakage during these critical steps, helping to reduce wafer and component defects.
Achieving the performance goals of a new generation of automotive electronics requires a precise precursor and plasma gas combination. The selection can be done with ease using the Entegris Toolbox.
We’re all obsessed with creating that perfect circuit pattern to improve wafer yield, parametric performance, and device reliability. What’s the connection between defects and material purity? We’re debunking the contamination control myths to reduce your process variations and improve component performance and reliability.
Alongside the increases in processing capacity, autonomous vehicles require significant memory advances to operate navigation, power, and infotainment systems effectively. The advances in materials and new device architecture improve cost of ownership for high-density phase change memory.