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Automotive Reliability
As automotive electronics become more complex and prevalent, the cost of failure in these devices rises. Hidden defects caused by small particles, gels, metal ions, and organic contaminants can lead to failures throughout the vehicle’s life, escalating costs and increasing risk. How can you prevent hidden defects? Use Entegris advanced chemical filtration and purification solutions in the semiconductor fab to examine the role of contamination in the formation of reliability failures.
Entegris Reliability Survey
Are You in the Business of Automaking, Electronic Devices, ICs, Materials, Tools?
We are all very focused on the performance of our electronic devices – speed, processing power, and memory. But what about reliability? We Invite you to participate in our survey!
Chinese – Traditional, Chinese – Simplified, English, Japanese, and Korean language versions available.
Featured Pictogram
The Small, Medium, and Large of Preventing Automotive Latent Defects
When a semiconductor leaves the fab, any latent defects can lead to costly field failures and recalls. How can you prevent hidden defects?
Featured White Paper
Preventing Automotive Latent Defects
This white paper details the challenges facing automotive OEMs, semiconductor fabs, and tier one suppliers, and identifies solutions for improving the cleanliness of the chemistries used to create microchips.
Featured Video
The Small, Medium, and Large of Preventing Automotive Latent Defects
Examine the ways contamination may play a role in the reliability of the electronic devices in today’s and tomorrows transportation.
Featured Presentation
A New Collaborative Approach to Automobile Industry Reliability Challenges
Antoine Amade, Regional Senior Director EMEA at Entegris discusses the challenges set by the car industry, the concept of “zero defects” and the need for a collaborative approach.
Featured Blog Post
Automobile Industry Reliability Challenges
SEMI spoke with Antoine Amade, Regional Senior Director EMEA at Entegris, about the challenges set by the car industry, and the concept of “zero defect” and the need for a collaborative approach ahead of his presentation at the Strategic Materials Conference at SEMICON Europa 2018, 13-16, November 2018, in Munich, Germany.
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Q: What is a latent defect?
- Defect appears following installation of the electronic device in the automobile, bus, commercial vehicle, or other transportation. These devices have passed all wafer inspection and burn-in tests prior to installation.
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Q: What is the expected lifetime of an electronic device in automotive applications?
- The generally observed lifetime is 10-15 years. The AEC (Automotive Electronics Council) provides a knowledge base of test standards and leading technical discussions to improve the reliability performance.
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Q: How are latent defects related to contamination in semiconductor manufacturing process?
- Chemical, gas, water, and air are used extensively to create circuit patterns and interconnects. These materials require a level of purity within the tolerance of the device being manufactured. Small, medium, and large particles, along with metal ions, gels, and other organics, may have an influence on the creation of latent defects on wafers. Blockage, or bridging of two parallel circuits with a contaminant is an example of one defect type.
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Q: How does a particle create an electrical bridge?
- Contaminants that remain on the wafer surface after a lithography step can create a bridged pattern feature that will be metallized in later processes.
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Q: Does inline metrology and wafer inspection identify all defects?
- These are critical tools to operate effectively. The detection performance is dependent upon the capabilities of the metrology and inspection technology in each fab. Those with higher sensitivity tools will be able to see smaller particles and defects. There is a size limitation in all tools currently. Filtration and purification solutions are available to remove particles below these sizes and contaminant types such as metal ions.
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Q: What is the difference between a filter and a purifier?
- Filters are generally used to remove particles and gels of all sizes, while purifiers are best suited to remove metal ions and other organics. A combination of each type can be the most effective solution to remove the widest variety of contaminants.
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Q: What is the right filter or purifier for each process area (CMP, Wet Etch and Clean, Photolithography)?
- Each chemistry type and process condition presents a unique challenge. Filters and purifiers are designed to remove specific contaminants as well as remove large volumes of contaminants at various points along the chemical and wafer production supply chain. Collaborate with the local Entegris team to create the optimized solution for your application.
Product Solutions
Oktolex tailored membrane technology enables precise contaminant targeting in a variety of lithography techniques and process materials without having a negative impact on the chemical composition. This technology can be applied to various filters to achieve maximum contaminant removal and increase device performance.
Using uniquely tailored membrane technology, versatile Purasol solvent purifiers can efficiently remove both dissolved and colloidal metal contaminants from a wide variety of ultrapure, polar and non-polar solvents including difficult to remove ketones like Cyclohexanone. This best-in-class solution for ultraclean chemical and raw material manufacturers reduces contaminants.
QuickChange filters provide advanced filtration of aqueous, outgassing, and aggressive acid and base chemistries in 28 nm or greater technology nodes. Enhanced cleaning technology effectively reduces metals, chlorides, and particle shedding to lower organic extractables to maximize wafer yield.
Guardian filters provide advanced, ultra-clean filtration of low-temperature, dilute acids and bases. Enables effective flow rate and contaminant retention performance in sub 90 nm technology nodes.
Solaris NMB CMP filters are best-in-class, point-of-tool slurry filters, maintaining low Large Particle Counts (LPC) and consistent particle size distribution in sub 45 nm technology nodes to prevent micro-scratches. These filters help reduce wafer defects and improve device performance.
The Planarcap® NMB CMP Filter is a best-in-class, point-of-dispense slurry filter with ultra-high particle loading capacity in sub 45 nm technology nodes to prevent microscratches. it enables superior hard particle removal and gel retention performance, which improves contamination control and process reliability.
The Planargard® NMB Bulk CMP Filter is a best-in-class, point-of-dispense slurry filter with ultra-high particle loading capacity in sub 45 nm technology nodes to prevent microscratches. Offers superior hard particle removal and gel retention performance at the point of dispense, reducing costly wafer defects.
The Microgard™ Bulk Photochemical Filter is a clean, solvent-based, bulk photochemical filter with high flow rate performance and contaminant retention capabilities. These filters reduce metallic and ionic contamination in your process.