Front-end to Back-end Solutions
Total Wafer Carrier Solutions that Protect Your Investment
A single carrier of 25 patterned, 300 mm semiconductor wafers may hold to $750,000 worth of technology. With that much investment, protecting the purity, safety, and security of the wafers is paramount to your business.
Fortunately for semiconductor manufacturers, Entegris provides full carrier solutions to monitor, protect, transport, and deliver your valuable wafers – including thick, thinned, or warped wafers – from the front-end through the back-end of the fab and on to advanced packaging.
White Paper
White Paper
White Paper
Pictograms
Advanced Back-End Packaging Solutions
Changing wafer shapes present a challenge for many fabs. But that challenge is met with our Advanced A300 Front Opening Unified Pods (FOUPs) and Contactless Horizontal Wafer Shippers. Our solutions provide for safe wafer transport whether they’re thin, thick, or warped.
FOUP Maintenance: Increase Longevity, Maximize Yield
This pictogram illustrates how following industry-leading guidance from Entegris for proper FOUP inspection and maintenance, a fab can increase FOUP life and improve device yield by preventing contamination from worn components.
Beginning-to-End Wafer Handling Solutions
300 mm wafers can hold 15,000 valuable components, and these wafers are often transported in groups of 25 units. Doing the math, a single container may be holding $750,000 worth of technology. Each of these microenvironments is designed to protect the safety, security, and purity of the wafers throughout the fabrication life cycle. Entegris provides beginning-to-end wafer handling solutions that require minimal human intervention. Here’s how they work.
Animation
The Trusty FOUP and Horizontal Wafer Shipper
Our reliable FOUP design handles 25 traditional 300mm wafers and has done so safely and securely for many years. See how we continue to provide safe solutions for novel wafer designs that may be thick, thin, or warped. Runtime: 01:28
White Paper
Yield Advantages Through Maintaining and Upgrading FOUP Populations
Wafer transport and handling systems are an essential part of the semiconductor manufacturing process flow. They help maintain a clean wafer environment and mitigate yield risk caused by human interaction with wafers. This paper focuses specifically on FOUPs, and how yield advantages can be achieved simply through proper maintenance and upgrades of your FOUP fleet.
Video
Wafer handling and contamination control
Watch as Dr. Poshin Lee, Director, Technology Management, explains that microchip fabrication is fraught with yield-impacting perils and that Entegris FOUPs are designed to control contamination and meet the most stringent semiconductor specifications to support integrated circuit technology advancements. Runtime: 03:19
Webinar
Enabling Yield Advantages
A semiconductor manufacturer may have a fleet of FOUPs that handle wafers hundreds of times throughout the manufacturing process. These microenvironments are trusted to be free of contaminants and conductance, but like any other mechanical object they have parts that wear over time.
Join Yossi Lax, global service manager and technology specialist, to learn the best methods for properly maintaining FOUP fleets to increase yield.
Brochure
Total Wafer Carrier Solutions
Wafer carrier solutions can protect your investments and help you realize bottom-line profits from the front-end through to the back-end of the fab. Read about our full-pitch FOSBs, Spectra FOUPs, and SmarkStack® horizontal wafer shippers.
Interested in Realizing Bottom Line Profits from Wafer Carrier Selection
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Contact UsProduct Solutions
Advanced A300 FOUP designs preserve the benefits of our traditional wafer carrier solutions while adding support for thinned or stacked and bonded wafers that can sag or warp.
The SB300 front opening shipping box (FOSB) secures wafers during shipment and protects against contamination, vibration, and shock events. Our FOSB is the first to be FIMS compatible, and has molded-in wafer supports that set it apart from the competition with precise and permanent wafer plane positioning for the entire life of the FOSB.
Our front-opening unified pod (FOUP) holds 300 mm wafers safely and securely while they are transported and transferred into thousands of sophisticated process steps. These FOUPs provide superior microenvironment control, optimum automation integration, and low cost of ownership.
Our SmartStack contactless horizontal wafer shippers protect highly sensitive, finished wafers against ionic contamination, outgassing, and mechaical elements during transport to their final destination. These advanced wafer shippers enable safe transport and storage of 300 mm, 200 mm, and 150 mm wafers without the risk of contamination.