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Join us at the following speaking engagements:

Wednesday, February 26 | 1:40 PM - 3:00 PM

Conference: Advances in Patterning Materials & Processes
Session 9: Supplier

Addressing metallic contaminants in the photochemical supply chain 

Abstract:

Metal contaminants are notorious yield detractors throughout semiconductor unit processes. Metallic contaminants can create small, hard-to-detect defects that can eventually result in cone defects and gate leakage. Because these contaminants are so hard to detect, it is extremely difficult to pinpoint their root cause and identify opportunities to remove them. Clean photochemicals experience many contamination opportunities between their final quality control checks at the end of manufacturing and dispense onto a wafer. The complexity of the interactions of metal contaminants and the components in photochemicals is an important consideration when designing removal methods. Learn about the different types of metal contaminants in photochemicals and raw materials, review how these contaminants are removed using membrane-based technologies, and define new methodologies to better target metal in photochemicals.

Wednesday, February 26 | 5:30 PM - 7:30 PM    

  • A novel filter screening methodology for Si hardmask materials in EUV lithography

    Tetsu Kohyama, Kozue Miura, Nihon Entegris K.K. (Japan)

  • Point-Of-Use filtration of non-CAR resists for EUV lithography

    Aiwen Wu, Entegris, Inc. (USA); Harvey Tang, Entegris Singapore Pte Ltd. (Singapore); Hareen Bayana, Entegris GmbH (Germany); Gregg Conner, Entegris, Inc.

  • Improving EUV underlayer coating defectivity using Point-Of-Use filtration

    Aiwen Wu,Entegris, Inc. (USA); Hareen Bayana, Entegris GmbH (Germany); Philippe Foubert, imec (Belgium); Douglas Guererro, Andrea M. Chacko, Brewer Science, Inc. 

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