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Entegris is pleased to be a sponsor of SPCC, the world’s largest conference dedicated to cleaning and preparation. We will be on site to share how our integrated solutions improve stability, increase uptime, and reduce defects in your CMP process.View Conference Site
Entegris is pleased to be a sponsor of SPCC, the world’s largest conference dedicated to cleaning and preparation. We will be on site to share how our integrated solutions improve stability, increase uptime, and reduce defects in your CMP process./content/entegris-live/en/home/about-us/events/surface-and-preparation-cleaning-conference-2019
Entegris will present the following topics during the conference:
Monday, April 1 | 3:00 PM
Michael White, Director, pCMP Development
Wednesday, April 3 | 3:05 PM
New Methods to Reduce Variation in Bare Wafer Particle Inspection Results
Harvey Tang, Applications Engineer
Wednesday, April 3 | Evening Poster Session
Novel method to characterize the retention of polydisperse particles by advanced membranes
Suwen Liu, Ph.D., Principal Scientist
Understanding Interfacial Surface Interactions: Dielectric Wafer – Slurry Particles, Defectivity Improvements and Current Challenges for Low pH W-Post CMP Cleaning Formulations
Daniela White, Senior Principal Scientist
Three-dimensional vertically-stacked memory architectures offer exponential gains in flash memory storage, but they also introduce fundamental new challenges at the device fabrication and integration level. These challenges affect all aspects of the flash memory product chain, from design to supply to material handling, manufacturing, and delivery.
To achieve optimum wafer yield and reliability, the microelectronics industry needs to address the increased materials consumption requirements and material purity challenges from chemical manufacture to point-of-use.
High Purity Chemical Manufacturing
The Fight for Purity in Chemical Manufacturing
Contamination control remains one of the largest challenges as integrated circuit (IC) technology advances. Better contamination control can significantly improve yield.
SPCC Poster Presentations
We invite you to download our presentations from the
2018 SPCC conference using the links below:
PlanarClean® AG Cleaning Solutions are designed for advanced Cu post-CMP process. The proprietary formulations offer increased performance through enhanced reliability and yield, low to zero corrosion and defects and increased queue time.
Micro-machined SiC substrate with conformal CVD diamond coating delivers long-life, highly uniform pad conditioning while minimizing substrate damage. Planargem® CMP Pad Conditioners offer leading-edge, customer-tailored performance across all aspects of the CMP Process.
Best-in-class, bulk slurry filter with ultra-high particle loading capacity for bulk processes in sub 45 nm technology nodes. Enables superior hard particle removal and gel retention performance to prevent microscratches.
Best-in-class, point-of-dispense slurry filter with ultra-high particle loading capacity in sub 45 nm technology nodes to prevent microscratches. Enables superior hard particle removal and gel retention performance.