Advanced Coatings


Semiconductor processing at advanced nodes requires extreme levels of cleanliness to minimize the risk of yield loss associated with submicroscopic contaminants. 3D structures pose additional demands as the number of lengthy processing steps increases. Cleanliness requirements extend to the tools used inside etch and deposition chambers, which can serve as sources of contamination and affect long-term process control. 

At Entegris, we understand these challenges and offer precision-engineered coatings that extend tool life while improving device yield.