Join Us
Thursday, October 8, 2026 | 8:30 AM – 1:30 PM
Join Entegris experts for a focused morning of presentations covering the latest advances in CMP slurries, pads, filtration, process monitoring, sustainability, and advanced packaging applications.
The program will also feature a guest presentation from CEA-Leti on recent progress in die-to-wafer CMP optimization for advanced packaging, demonstrating the power of collaboration to support industrial transfer.
What you'll learn:
- CMP innovations enabling advanced packaging, 3D integration, and next-generation semiconductor applications.
- Next-generation slurry and pad technologies to improve planarization performance and reduce defects.
- Real-time monitoring and advanced filtration strategies that strengthen yield, process control and consistency.
- Sustainable approaches to CMP, including consumable lifetime extension and pad circularity initiatives.
- Insights from Entegris and CEA-Leti on consumable optimization for advanced packaging applications.
Spaces are limited - secure your place today!
Featured Program
| 08:30 | Registration & Welcome Coffee |
| 09:00 |
Entegris at 60: Advancing Performance through Collaboration and Innovation
Antoine Amade, President, EMEA Region |
| 09:15 |
More Than a Product - A Solution Story Chad Teters, Lead Product Management |
| 09:30 |
High-Performance Copper CMP Solutions for Advanced Packaging and 3D Integration Pankaj Singh, IC Polishing Solutions R&D Director |
| 09:55 |
High-Rate Ceria CMP Solutions for Advanced Dielectric Planarization Hanks Huang, Advanced Dielectrics Business Director |
| 10:20 |
Next-Generation CMP Pad Technologies for Advanced Planarization, Defectivity Control, and Extended Consumable Lifetime Pankaj Singh, IC Polishing Solutions R&D Director |
| 10:35 |
From Waste to Value: Reinventing CMP Pads Through Circular Innovation Paola Gonzalez Aguirre, Ph.D., Lead Scientist, Research Associate |
| 10:45 | Break |
| 11:00 |
Real-time Concentration Monitoring for Enhanced CMP Efficiency Philipp Lehmann, Field Applications Engineer - Fluid Management |
| 11:25 |
Optimizing CMP Filtration: From Particle Capture Mechanisms to Advanced Defect Control Günter Haas, Ph.D., Field Application Engineer - Liquid Microcontamination Control |
| 11:50 |
From Filtration to Planarization: D2W CMP Consumable Set Evaluation Clément Castan, R&D CMP Engineer | CEA-Leti |
| 12:15 |
Advanced Packaging: From a Materials Supplier’s Perspective Gilbert Parry, Director Advanced Innovation and Technology |
| 12:45 | Lunch |
Industry Insights
Chemical Mechanical Planarization (CMP)
Major fabs understand the need for complete solutions that improve yield in all aspects of the CMP process. Shrinking feature size, along with the need for tighter defectivity and particle control in the CMP slurry is driving innovative changes in filtration and monitoring systems. As more layers of each chip require CMP to achieve planarity, the process challenges are increasing dramatically.
Interface integrity defines yield in advanced packaging, governing how surfaces, materials, and processes interact to determine performance and reliability. As architectures move toward hybrid bonding, high density RDL, and panel level integration, interfaces are created once and carried through multiple stresses with no opportunity for repair.
With today’s faster, diverse, and more thermally efficient device designs, success depends not just on perfecting individual components, but on ensuring the entire advanced package performs flawlessly to design specifications for everyday use. Entegris delivers proven technologies that safeguard materials purity, materials performance, substrate integrity and yield at the most critical stage of your investment. See our solutions to the most common and complex advanced packaging challenges.