Meet Us at Booth S45 – A Must-Stop on the Rally
Become part of the event rally! Our booth is an official stop you can’t skip, your chance to engage directly with our experts.
Take on our challenge by answering one question and discover how Entegris enables next generation semiconductor manufacturing through advanced materials and high purity solutions.
Play along and unlock your chance to win high tech prizes as we celebrate 60 years of Entegris and 20 years in Dresden!
Executive Insight on the Main Stage
Tuesday, June 16 | 11:30 a.m. – 12:30 p.m.
Under Pressure: How Europe’s Largest Front-End Site Sustains Industrial Growth
We are also proud to contribute at the highest level of the conference: our CEO, Dave Reeder, will join the panel discussion.
Entegris has been selected to bring the perspective of a global semiconductor materials leader, sharing insights on what it takes to build and sustain competitive semiconductor regions worldwide.
Speaker:
David Reeder, President and Chief Executive Officer, Entegris
Event Related Content
As automotive electronics become more complex and prevalent, the cost of failure in these devices rises. Hidden defects caused by small particles, gels, metal ions, and organic contaminants can lead to failures throughout the vehicle’s life, escalating costs and increasing risks. How can you prevent hidden defects?
To achieve optimal wafer yield and reliability, the microelectronics industry needs to address increased materials consumption requirements and materials purity challenges from chemical manufacture to point of use.
Achieving the performance goals of a new generation of automotive electronics requires a precise precursor and plasma gas combination. The selection can be done with ease using the Entegris toolbox.
Wafers are continuously transported and stored through the front and back end of semiconductor manufacturing lines. Entegris solutions prevent corrosion that may lead to reliability failures and wafer breakage during these critical steps, helping to reduce wafer and component defects.
With today’s faster, diverse, and more thermally efficient device designs, success depends not just on perfecting individual components, but on ensuring the entire advanced package performs flawlessly to design specifications for everyday use.