Event Presentation
We are excited to present the following discussions during the virtual conference:
Tuesday, June 8
- Enabling Materials: A Holistic Approach
Speaker, Jim O’Neill, SVP and Chief Technology Officer
Wednesday, June 9
- Removal of Metals from Strong and Weak Acids Using Membrane Based Solutions to Reduce On-Wafer Defectivity
Speaker: Ashtosh Bhabhe, Applications Manager
Access Free On Demand Webinars
Solving CMP Polishing Challenges with the Next Generation CMP Pad Conditioners
In this webinar, Doruk Yener Ph.D., R&D manager, shares the challenges with CMP pad conditioning and how a tailored CMP pad conditioner platform can solve these challenges and meet customer requirements.
Acceleration of the Materials Era
Join Entegris SVP and Chief Technology Officer, Jim O’Neill as he discusses:
- Effects of COVID-19 on semiconductor growth
- Increasing materials intensity in the era of materials advancement and putting it all together
This presentation is moderated by Wenge Yang, VP of market strategy and includes live Q&A with Entegris technology experts.
Materials Innovation: Holistic Solutions for Improved Yield and Reliability
Join Entegris’ SVP, CTO, Jim O’Neill in this webinar to learn about: Digital transformation and the demand for higher performance chips, new, purer materials needed to deliver high-yield and long-term reliability, and holistic materials and handling solutions to enable a new approach to the most challenging yield problems of advanced node technologies.
A New Collaborative Approach to Defectivity Challenges in the Automotive Industry
Join Antoine Amade, EMEA/NA senior director – Entegris Automotive Program, in this recorded webinar as he explores the ‘New Collaborative Approach’, a new model of engagement targeting contamination control to improve automotive defectivity and reliability.
Polishing Chemically Inert and Mechanically Hard Materials
In this webinar, Dr. Rajiv Singh, VP, CMP slurries, addresses methods to achieve high polish rates and enhanced surface finish in silicon carbide, gallium nitride, sapphire, and carbon-based materials.
Please contact your local Entegris Sales Representative to schedule a meeting or for more information.
Please contact your local Entegris Sales Representative to schedule a meeting or for more information.
Please contact your local Entegris Sales Representative to schedule a meeting or for more information.
Technical Resources
We provide solutions for surface preparation and integration including: pCMP cleans, post etch cleans, selective etch chemistries, CMP disks, and CMP brush solutions.
Decades-old practices are no longer effective when increasing the number of 3D NAND structures to 96 layers and beyond.
Contamination and purity challenges can be tackled by changing how deposition and etch tools are coated, while integrating new chemistries in deposition and etching steps can alleviate vertical scaling challenges.
We are in the unique position to help customers maintain a clean chemical delivery environment with contamination-controlled chemical packaging, filtration, pumps, and fluid handling products that will increase product yield and reduce financial loss.
The digital transformation we are all experiencing as consumers present new challenges to material makers, as well as opportunities. Contamination control remains one of the largest challenges as integrated circuit (IC) technology advances. Better contamination control can significantly improve yield, and a one percent yield improvement can mean up to $150 million per year in net profit.
As automotive electronics become more complex and prevalent, the cost of failure in these devices rises. Hidden defects caused by small particles, gels, metal ions, and organic contaminants can lead to failures throughout the vehicle’s life, escalating costs and increasing risk.
Examine the role of contamination in the semiconductor fab air, wafer, and chemicals/gas/water using the New Collaborative Approach.