Facility
Clean materials delivery and ultraclean fab environment solutions to reduce fab defects and improve yield in advanced packaging applications.
Purity in the advanced packaging fab environment is paramount to meeting device yield and performance standards. A holistic clean material delivery strategy can control the integrity of liquids, gases, ambient environment, wafer surfaces, and masks. This approach protects key contamination points throughout the supply chain—from material and wafer generation to delivery, storage, and dispense.
Defect Prevention and Process Operational Solutions
Liquid Contamination Control
Prevent wafer defects through the electronic chemicals supply chain with integrated contamination control, process monitoring, and delivery solutions.
Gas Contamination Control Solutions
Prevent wafer defects through the electronic gas supply chain with integrated contamination control and delivery solutions.
ESD Fluid Management
Prevent wafer level ESD defects, protect devices, and ensure operator/facility safety with continuously conductive polymers.
ESD Grounding Straps
Dissipate electrostatic charge to protect wafers/panels and devices and ensure operator/facility safety.
ESD Foups
Prevent ESD particle generation and accumulation in wafer and handling applications.
AMC Fundamentals
Learn how to control airborne molecular contaminants (AMC) with Entegris’ See It. Control It. analytical services model to recommend a filtration solution for your unique ambient environment.