Advanced Coatings
Semiconductor processing at advanced nodes requires extreme levels of cleanliness to minimize the risk of yield loss associated with submicroscopic contaminants. 3D structures pose additional demands as the number of lengthy processing steps increases. Cleanliness requirements extend to the tools used inside etch and deposition chambers, which can serve as sources of contamination and affect long-term process control.
At Entegris, we understand these challenges and offer precision-engineered coatings that extend tool life while improving device yield.
Recent Webinar
Protecting Plasma Chamber Parts and Components with Advanced Coatings
Learn the importance of advanced coatings for chamber parts and components, and discover three successful coating methods in this recorded webinar with Connor Gallegos, Product Manager, and Nilesh Gunda, Director, Coatings Product Technology.
Featured White Paper
Reducing Contamination and Improving Yield: Precision Engineered Techniques for Coating Plasma Chamber Components
Learn more about the importance of precision-engineered coatings for etch chamber components that can help reduce contamination risk and produce higher-yielding semiconductor devices.
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Three Successful Precision Engineered Techniques for Coating Plasma Chamber Components
Skyrocketing demand for high-density digital storage has changed device design and fabrication. New materials and processes are required to ensure reliability at high volumes. This places new burdens on the cleanliness of etch and deposition chambers, to avoid yield loss and maintain consistent results for each wafer. Precise environmental control inside each chamber is necessary to maintain etch rates and the electrical integrity of deposited layers.
Advanced coating techniques are necessary.
Advanced coating techniques are necessary.
Product Solutions
Pegasus™ 100 series coatings are a family of precision-engineered PVD coatings tailored for fluorine plasma etch applications. Our Yttrium-based Oxide coatings are deposited at low temperatures and can be deposited on aluminum, alumina, stainless steel and other commonly used substrate materials, with superior adhesion. These coatings are high purity, exhibit homogeneous microstructure and are conformal to the substrate surface.
Pegasus™ 500 series coatings are a family of precision-engineered PVD coatings tailored for Fluorine and Chlorine plasma etch applications. Our Aluminum-based Oxynitride coatings are deposited at low temperatures and can be deposited on aluminum, alumina, stainless steel and other commonly used substrate materials, with superior adhesion. These coatings are highly transparent in the visible and IR range.
Caerus™ family of Aluminum-based Oxide coatings are deposited at low temperatures with superior film quality. Our Caerus coatings are highly conformal, dense, pinhole-free and exhibit homogeneous microstructure. The coatings have excellent adhesion and provide outstanding corrosion and etch resistance properties. They are also characterized by superb electrical voltage stand-off and exceptional trace metal diffusion barrier layer characteristics.