Our scalable portfolio includes high performance slurries that reduce COO and maintain low defectivity
We are a market leader in the design and production of CMP slurries for polishing ultra-hard surface materials such as SiC (silicon carbide), sapphire, GaN (gallium nitride), and diamond (lapped or mechanically polished) into epi-ready condition. The synergy between the specialized chemistry and engineered particles is a key enabling technology for our CMP solutions. Our broad slurry portfolio is optimized for batch and single wafer CMP systems and provides high uniformity and easy scalability to multiple wafers for high-volume manufacturing.
Robust R&D efforts, combined with our state-of-the-art capabilities and team of world-renowned scientists and engineers, help our customers solve their most complex planarization and surface preparation challenges. Using best-know-methods (BKM), our R&D and manufacturing teams can custom design slurries for specific applications. Unique processes we have developed include an ultra-rapid process to fabricate SiC substrates, sub-surface damage-free sapphire windows, and ultra-precise copper polishing.
The Silicon Precursor Toolbox for Low-temperature Deposition