This virtual event is devoted to leading-edge research in the field of advanced metallization and 3D integration for IC applications.
Technical Resources
Entegris SVP and Chief Technology Officer, Jim O’Neill discusses the effects of COVID-19 on semiconductor growth and increasing materials intensity in the era of: EUV, vertical scaling, new metallurgies, automotive and materials advancement.
Entegris' holistic approach to enabling performance, yield, and reliability in emerging logic devices, including innovations in specialty materials for R&D and production, delivery and storage systems, material purity and wafer cleanliness, environmental purity, and finished wafer protection.
Through close collaboration with chip and tool manufacturers, we develop and test candidate precursors for the next generation films, devices, and process requirements. Film and process viability is demonstrated using in-house ALD and CVD tools.
Entegris' toolbox of pre-screened precursors is designed to solve low- temperature deposition challenges, and save on costly, time-consuming process development.
We provide solutions for surface preparation and integration including:
- pCMP cleans
- Post etch cleans
- Selective etch chemistries
- CMP disks
- CMP brush solutions
Contamination and purity challenges can be tackled by changing how deposition and etch tools are coated, while integrating new chemistries in deposition and etching steps can alleviate vertical scaling challenges.