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Discover how through the science of innovation, we can partner together to solve your most complex manufacturing process challenges.
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Featured Video
GAAC Panel Discussion: Collaboration Across the Automotive and Semiconductor Supply Chains
Watch Andreas Aal, CARIAD, a Volkswagen Group Company, Bettina Weiss, SEMI, Antoine Amade and Jennifer Braggin, Entegris, explore the intersection of automotive innovation and semiconductor technologies and describe the opportunities presented by collaborating across these supply chains.
Featured Content
As the automotive paradigm shifts from mechanical to electronic-centric vehicles, carmakers must now meet parts per billion (ppb) failure rates.
To achieve these goals and improve long-term reliability, they look to semiconductor manufacturers and the automotive component supply chain to collaborate and assure the functional safety of new modes of transportation.
As automotive electronics become more complex and prevalent, the cost of failure in these devices rises. Hidden defects caused by small particles, gels, metal ions, and organic contaminants can lead to failures throughout the vehicle’s life, escalating costs and increasing risk. How can you prevent hidden defects?
To achieve optimal wafer yield and reliability, the microelectronics industry needs to address the increased materials consumption requirements and material purity challenges from chemical manufacture to point of use.
Achieving your zero-defect goals require contaminant-free process gases. Preventing these defects requires a holistic approach from the gas generation source through the delivery, storage, and dispense steps in the semiconductor fab.
Achieving the performance goals of a new generation of automotive electronics requires a precise precursor and plasma gas combination. The selection can be done with ease using the Entegris toolbox.
Through the front (FEOL) and back (BEOL) end of semiconductor manufacturing lines, wafers are continuously transported and stored. Entegris solutions prevent the corrosion that may lead to reliability failures and wafer breakage during these critical steps, helping to reduce wafer and component defects.