A Defect Reduction Collaboration Model
Semiconductor manufacturing variability increases as new materials, designs, techniques, and equipment are introduced and installed. Contamination variables also increase, and they require a new strategy for effective management.
Targeted removal is a promising solution that mitigates contaminants which negatively impact wafer yield, device performance, and long-term reliability without disturbing material composition. Fab managers, engineers (process, equipment, quality, reliability), equipment designers, component makers, and materials scientists all hold pieces to the defect prevention puzzle. By collaborating and using targeted contaminant removal strategies, we can solve some of today’s most complex semiconductor manufacturing challenges.