Contamination control in a semiconductor fab is crucial for achieving acceptable device yields as feature size decreases and 3D structures proliferate. Advanced filtration and purification of air, bulk or specialty gas, and chemical throughout its process life cycle has become a critical aspect in reducing defects and enabling higher yields. IDMs (integrated device manufacturers) continue to tighten the acceptable specifications on parameters such as particles, metals, and organics in every chemical and gas they receive.
Particles, gels, metals, and airborne molecular contamination (AMC) all affect products, processes, and equipment in varying ways that lead to defective products. Liquid filters and purifiers provide a line of defense to prevent defect-causing contaminants from reaching the wafers and substrates. Whether for point of use or bulk delivery, in chamber or on wafer, in the cleanroom or on a tool, we have a long history of providing advanced liquid, gas, and air purification and filtration solutions to address your productivity and reliability requirements at any technology node.
The Fight for Purity in Chemical Manufacturing
The digital transformation we are all experiencing as consumers present new challenges to material makers, as well as opportunities. Contamination control remains one of the largest challenges as integrated circuit (IC) technology advances. Better contamination control can significantly improve yield, and a one percent yield improvement can mean up to $150 million per year in net profit.
Explore solutions to the gas purity challenges faced by semiconductor manufacturers.
Lithographers in semiconductor manufacturing are tasked with the challenge of creating circuit patterns that meet production yield, parametric performance, and long-term reliability requirements in the electronic devices our digital lives depend upon. To do this, predicting and controlling variables in the manufacturing systems, materials, and processes are critical.
The lithographer’s toolkit provides a practical guide to reduce process variations that threaten your semiconductor fab performance.
To enable the effective manufacturing of electronic devices for the Fourth Industrial Revolution, fabs (integrated circuit manufacturers) are challenged with producing denser and more complex chips with smaller line spacing and 3D features. The digital transformation we are all experiencing as consumers present new challenges to material makers, as well as opportunities. Contamination control remains one of the largest challenges as integrated circuit (IC) technology advances.
EUV reticle pods are highly specialized pieces of equipment that fulfill a critical role in EUV lithography. They must protect the reticle during use, storage, and transportation while not introducing additional contamination or damage.
Control of airborne molecular contaminants (AMC) enable manufacturers of integrated circuits (IC) to improve their production yield and further assure the integrity of electronic devices. Contaminant removal is achieved with AMC filters throughout the fab environment and at the tool locations.