Join Us | Silicon Saxony Hall B1 | Booth B1221
Find Entegris at the Silicon Saxony booth! This trade association brings together local high-tech organizations to communicate, collaborate, and provide opportunities for development. Visit us and discover how we can partner together to solve your most complex manufacturing process challenges through the science of innovation.
Contact europe@entegris.com to get a free voucher and redeem it online.
Featured Session
November 16, 11:10 AM – 13:10 PM | Executive Forum, Hall B2
Connecting the Automotive Ecosystem Towards More Mature SiC Manufacturing
Don’t miss this session, organized in partnership with SEMI, which will focus on the challenges of silicon carbide (SiC) manufacturing. Antoine Amade, president of the EMEA region at Entegris, will be moderating this session with experts from across the industry. Niraj Mahadev, vice president of the Advanced Planarization Solutions Division at Entegris, will also share his presentation, Meeting the SiC Gold Rush with Entegris Capabilities.
View the Agenda
Industry Insights
Silicon carbide (SiC) wafers are far from average. Chemical mechanical planarization (CMP) plays a key role in enabling high volume manufacturing for devices built on SiC substrates. As demand for these devices increases, optimizing the CMP process becomes crucial to ensuring the desired surface quality and planarity required for device fabrication.
As automotive electronics become more complex and prevalent, the cost of failure in these devices rises. Hidden defects caused by small particles, gels, metal ions, and organic contaminants can lead to failures throughout the vehicle’s life, escalating costs and increasing risk. How can you prevent hidden defects?
As the automotive paradigm shifts from mechanical to electronic-centric vehicles, carmakers must now meet parts per billion (ppb) failure rates.
To achieve these goals and improve long-term reliability, they look to semiconductor manufacturers and the automotive component supply chain to collaborate and assure the functional safety of new modes of transportation.
To achieve optimal wafer yield and reliability, the microelectronics industry needs to address the increased materials consumption requirements and material purity challenges from chemical manufacture to point of use.
Achieving your zero-defect goals require contaminant-free process gases. Preventing these defects requires a holistic approach from the gas generation source through the delivery, storage, and dispense steps in the semiconductor fab.
Achieving the performance goals of a new generation of automotive electronics requires a precise precursor and plasma gas combination. The selection can be done with ease using the Entegris toolbox.
Wafers are continuously transported and stored through the front (FEOL) and back (BEOL) end of semiconductor manufacturing lines. Entegris solutions prevent corrosion that may lead to reliability failures and wafer breakage during these critical steps, helping to reduce wafer and component defects.