As the number of CMP steps increases and the thickness of material being removed decreases, CMP defect reduction becomes a greater challenge. The more complex the chip architecture and the smaller the critical feature size, the greater the risk. With less room for error, process optimization of CMP slurries is necessary to achieve desired yields. Tight control over slurry properties including chemistry, working particle size, and particle size distribution helps achieve the desired removal rate and minimize CMP-induced defects.
Entegris is in the unique position to provide a single sourced process monitoring CMP solution to increase yield, device performance, and system reliability to reduce financial loss in the semiconductor fab and liability in the electronic device supply chain.
Featured Webinar
Accurately Quantifying Tails of Particle Size Distributions AZO Webinar
Learn how to use techniques such as single particle optical sizing to accurately characterize particles in the tails of distributions, which can help optimize fluid performance.
Featured White Paper
Multivariable Process Monitoring to Enhance CMP Yield
This white paper discusses three types of process data analytics that can help ensure high CMP yields: electrochemical analysis during blending, in-line process chemistry monitoring, and particle sizing determination.
Chemical Mechanical Planarization (CMP)
This animation explains how, with help from complementary Entegris technologies, fabs can continuously monitor CMP slurry - from blending
through point of use - and greatly reduce yield loss and achieve CMP mastery. Runtime: 01:41
GV148 Window Cleaner
Animation demonstrating how the optional automated in situ window cleaner removes slurry scale buildup on the InVue® GV148 concentration monitor's sapphire window. The routine clean is performed during tool uptime, eliminating production interruptions while enabling tighter process control and higher wafer throughput. Runtime: 01:55
Pictogram
Increasing Yield Through Complete Control of CMP
Pictorial explaining the importance of continuously monitoring CMP slurry health throughout the wafer manufacturing process using Entegris' complementary tools that help reduce yield loss.
Featured Brochure
BrochureComprehensive listing of our reliable, cost-effective slurry process monitoring solutions that provide a line of defense to prevent defect-causing contaminants in current and new technology nodes.
Product Solutions
Controlling Contaminants
At Entegris, we understand the unique challenges of CMP contamination control to reduce defects and improve yield. From fast and accurate measurement control, to advanced particle characterization, to chemical concentration monitoring, Entegris is well-positioned to offer CMP process stability monitoring solutions proven to increase yield, device performance, and system reliability to reduce financial loss in the semiconductor fab and liability in the electronic device supply chain.
Our particle characterization solutions enable customers to perform particle size analysis online, in real time, directly in the fluid stream process. In advanced-node CMP applications, automating the monitoring process can help prevent costly yield excursions.
Our SemiChem APM is a wet chemical monitoring system that automatically samples, analyzes, and reports quantitative chemical concentration of critical processes. The first step in the monitoring process, the SemiChem APM connects to the blending station and provides class-leading chemical concentration data the helps optimize slurry stability.
The composition of the slurry blend can degrade over a day’s use, introducing unwanted variability into the CMP process. We offer cost-effective, easy-to-install InVue GV148 concentration monitors that serve as a pre-check or early warning system to verify whether the slurry still meets specifications. If the concentration has drifted too far, an alarm will trigger and the process can be stopped, averting a potential wafer scrap or yield problem